Process for avoiding blister formation in electroless metallization of ceramic substrates
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United States of America Patent
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May 19, 1987
Issued Date -
N/A
app pub date -
Dec 10, 1984
filing date -
May 10, 1984
priority date (Note) -
Expired
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Abstract
A process for avoiding blister formation between a metal layer which is electrolessly deposited on a surface of a ceramic substrate and the substrate. The substrate is adhesion promoted with an alkali metal composition containing between 0.35 and 0.9 mole fraction alkali metal compound, and water in an amount which is sufficient to lower the melting temperature of the composition to between 145.degree. and 240.degree. C. and adhesion promote the ceramic surface with the molten composition in a time period between 1 and 200 minutes. Thereafter, the adhesion promoted ceramic surface may be activated to render it receptive to electroless metal deposition. The treated ceramic surface is coated free of blisters using an electroless metal deposition bath with an adherent, metal layer having a thickness greater than 5 micrometers.
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