Semiconductor chip interface
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 19, 1987
Grant Date -
N/A
app pub date -
Apr 27, 1984
filing date -
Apr 27, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the contacts of the semiconductor chip. A plurality of transmission elements are located proximate the connector plate opposite from the semiconductor chip. A plurality of flexible conductors extend through the respective apertures of the connector plate. The flexible conductors are electrically coupled to the contacts of the chip and to the transmission elements.
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