Method of making multi-layer printed wiring boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 26, 1987
Grant Date -
N/A
app pub date -
Apr 26, 1985
filing date -
Apr 26, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-layer printed wiring board in which an internal board has a wiring pattern on both sides. Two conductive plates for establishing respective voltage planes are formed with a pattern of grooves to match the wiring pattern of the internal board. The internal board is then sandwiched to the two sides of the conductive plates, with the grooves registering with the wiring pattern, and with intermediate insulating layers. Further, insulated wiring patterns are formed on the exterior sides of the conductive plates together with through-holes through the assembly.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully