Apparatus for singling filled wafer slices
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United States of America Patent
Stats
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Jun 2, 1987
Grant Date -
N/A
app pub date -
Feb 11, 1985
filing date -
Feb 20, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
When it is desired to single consecutive filled wafer slices, which are advanced with abutting trailing and leading faces, respectively, so that the singled wafer slices are ultimately spaced apart, a separation between consecutive wafer slices is to be effected in time even if the wafer slices are filled with cream so that their filling layers will strongly adhere to each other. This can be ensured in that a transfer device is provided between a feeding conveyor for advancing consecutive wafer slices abutting at their trailing and leading faces, respectively, and a delivering conveyor for advancing the rows of wafer slices on a delivery plane, which is vertically spaced from the feeding plane, on which the wafer slices are advanced by the feeding conveyor, and the transfer device pulls each leading wafer slice from the next succeeding wafer slice and moves the pulled-off wafer slice to the delivery plane.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
FIRMA FRANZ HAAS WAFFELMASCHINEN INDUSTRIEGESSELLSCHAFT M B H GERSTLGASSE 25 A - 1210 W I E N AUSTRIA | Not Provided |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Haas, Johann | Klosterneuburg, AT | 84 | 987 |
Haas, jun Franz | Leobendorf, AT | 2 | 17 |
Haas, sen Franz | Vienna, AT | 4 | 31 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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