Sputter module for modular wafer processing system
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United States of America Patent
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-
Jun 2, 1987
Grant Date -
N/A
app pub date -
Apr 28, 1986
filing date -
Apr 28, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A machine for sputter deposition of a wafer workpiece also sputters on the wafer supporting mechanism. This causes a need for cleaning or replacement of the support mechanism. A sputter machine is provided in which the supporting mechanism can be isolated from the sputtering source, the pumps and other processing apparatus for cleaning without exposing the entire machine to atmosphere.
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Cited Art Landscape
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