Flexible printed circuits, prepared by augmentation replacement process
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United States of America Patent
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-
Jun 2, 1987
Grant Date -
N/A
app pub date -
Feb 12, 1986
filing date -
Feb 12, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides flexible printed circuits prepared by (i) applying a design on a silicone-impregnated fabric substrate with a printing ink comprising a mixture of (a) a curable silicone composition and (b) an effective amount of at least one finely divided metal powder; (ii) at least partially curing said silicone composition; and (iii) depositing a conductive metal on the surface of said printing ink.
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