Integrated circuit chip-and-substrate assembly
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United States of America Patent
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-
Jun 2, 1987
Grant Date -
N/A
app pub date -
Feb 17, 1984
filing date -
Feb 21, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In the interest of enhanced yield in the manufacture of 'wafer-scale' integrated circuits an assembly of integrated circuit chips is made by placing chips on a substrate. Chips have beveled edges as produced by crystallographically anisotropic chemical etching, and the substrate has wells, grooves, or openings having sloping walls. Chips are positioned on the substrate by bringing sloping walls and beveled edges in juxtaposition, and circuitry on chips is connected to circuitry on the substrate.
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