Surface acoustic wave devices and method of manufacture thereof
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United States of America Patent
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Jun 9, 1987
Grant Date -
N/A
app pub date -
Oct 11, 1985
filing date -
Oct 11, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A phase and amplitude compensated surface acoustic wave (SAW) structure is described in which computer controlled compensation is achieved by laser chemical etching of selective portions of a compound chemical film deposited on the surface of a piezoelectric SAW substrate in the path of propagation. The compound film comprises a layer of amplitude attenuating cermet material formed on the substrate and a phase compensating layer of molybdenum formed over the cermet material and in contact with the substrate surface.
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