Semiconductor packaging and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 9, 1987
Issued Date -
N/A
app pub date -
May 15, 1986
filing date -
Apr 2, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mounting means for a semiconductor integrated circuit, the mounting means comprising a semiconductor material having a mounting surface as one major surface thereof, a semiconductor integrated circuit mounted on the major surface of the semiconductor material, and means for electrically connecting the integrated circuit to the semiconductor material. The mounting means has a coefficient of thermal expansion similar to the semiconductor integrated circuit mounted thereon.
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