Die machining apparatus in automatic programming

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4672551
SERIAL NO

06732708

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

This invention has improved the automatic programming method which is used for machining the configuration of a curved surface of a die. The values of X and Y coordinates are calculated by a machining path production device through a curved surface configuration storage device. The value of Z coordinate in the third dimension is obtained by a machining point calculation device. If a curved surface in the Z axis is to be machined two or more times, a judgement circuit decides this and a calculation processing device calculates that the first machining is to be conducted in conformity with the curved surface and the second or later machining is to be skipped for rapid feeding, this decision being stored in a tool path data storing device.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • HITACHI SEIKI CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Murata, Shigeshi Abikoshi, JP 1 5
Ookuma, Tadashi Abikoshi, JP 1 5

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation