Tin, lead, or tin-lead alloy plating bath
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United States of America Patent
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Jun 16, 1987
Grant Date -
N/A
app pub date -
Feb 21, 1986
filing date -
Feb 22, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula ##STR1## wherein R is a C.sub.1-4 hydrocarbon radical, M.sub.1 is a hydrogen atom or alkali metal atom, M.sub.2 is an alkali metal atom, and X.sub.1 and X.sub.2 are each a hydrogen atom, OH, COON, or SO.sub.3 N (where N represents a hydrogen atom or alkali metal atom).
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