Surface mounted system for leaded semiconductor devices
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United States of America Patent
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-
Jun 16, 1987
Grant Date -
N/A
app pub date -
Jan 29, 1985
filing date -
Jan 29, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved surface mounted system for leaded semiconductor devices has J-shaped device leads soldered to respective portions of circuit pads on a printed circuit board, each lead having inner and outer surfaces of the J-shape covered with solder dewetting and solder wetting metals respectively which are metallurgically bonded to a metal core of the lead formed of a springy, relatively high electrical conductivity metal. The short leg of each J-shaped lead is curved and the outer, solder wettable surface of that curved lead part is soldered to a selected circuit pad portion, preferably by use of a pad or solder paste deposited on the circuit pad portion, while other surfaces of the lead are maintained substantially free of solder for avoiding solder bridging between leads and for assuring that an adequate amount of solder is retained between the curved lead part and the desired circuit pad portion to provide secure electrical connection to the printed circuit and secure surface mounting of the device on the circuit board.
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