Integrated circuit package and seal therefor
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United States of America Patent
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-
Jun 23, 1987
Grant Date -
N/A
app pub date -
Aug 4, 1986
filing date -
Aug 4, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An integrated circuit package having a substrate of ceramic material having a cavity therein, a resilient seal rim connected to the substrate, a lid that may be inserted within said rim and a band of shape-memory alloy surrounding the rim to compress the rim into contact with the lid to seal the package.
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