Epoxy resin composition

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4677144
SERIAL NO

06846103

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Abstract

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An epoxy resin composition consisting essentially of a heat-melted mixture obtained by mixing under heat 100 parts by weight of an epoxy resin having an epoxy equivalent of 200 or below and 0.5 to 10 parts by weight of polysulfone resin; a curing agent; and an inorganic filling material.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI DENKI KABUSHIKI KAISHA2-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ando, Toshiharu Amagasaki, JP 10 44
Itabashi, Yoshifumi Amagasaki, JP 10 96
Yasuda, Kazuo Amagasaki, JP 32 458

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