Humidity sensing apparatus
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United States of America Patent
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Jun 30, 1987
Grant Date -
N/A
app pub date -
Nov 22, 1985
filing date -
Nov 22, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit cooling device and a dew point hygrometer employing such a cooling device having a substrate with a peripheral region surrounding a central aperture, the substrate being overlaid by an insulating layer with a Peltier cooling device formed thereon. The Peltier device includes a plurality of alternate metallic segments of dissimilar metals arranged and joined to form first and second groups of corresponding junctions of which the first group is located over the peripheral region of the substrate and the second group is located over the central aperture.
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