Flexible printed circuit board having integrated circuit die or the like affixed thereto
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 30, 1987
Issued Date -
N/A
app pub date -
Jan 27, 1986
filing date -
May 31, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flexible printed circuit board assembly having an integrated circuit die bonded directly thereto. A first layer of the flexible printed circuit board assembly includes a plurality of conductive paths and geometrical patterns on each of its surfaces. The conductive patterns include pads for mounting the integrated circuit die and connecting the wires from the integrated circuit. Additional intermediate layers of the flexible printed circuit board assembly, having an aggregate thickness greater than the height of the integrated circuit die and associated leads bonded thereto, surround the integrated circuit die. The top layer of the flexible printed circuit board provides for total encapsulation of the integrated circuit die for protection thereof. In the preferred embodiment that portion of the top layer which covers the integrated circuit die is opaque to prevent the passage of ultraviolet light which might otherwise cause damage to the integrated circuit.
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