Electronic chip-carrier heat sinks
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United States of America Patent
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Jul 7, 1987
Issued Date -
N/A
app pub date -
Jul 28, 1986
filing date -
Aug 7, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Dissipation of heat from a socketed leadless electronic chip-carrier package is promoted by a heat-conducting metal socket cap distinctively overlying and guiding heat away from the socketed package fully along a broad planar surface area, the socket cap being of a unitary construction which both mechanically holds the package securely mated with a multi-pin socket and also cools the package by way of an integrated array of heat-radiating elements; edge clasping of the cap with a chip-carrying socket avoids interference with needed conduction of heat away from central areas of the package and cap.
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