Dielectric materials
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United States of America Patent
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-
Jul 14, 1987
Grant Date -
N/A
app pub date -
Feb 26, 1985
filing date -
Feb 26, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Dielectric materials having low dielectric constant are provided, the materials comprising fabrics impregnated with thermosetting resins, at least a portion of the fibers in the fabrics being fluorocarbon fibers. Also provided is a method of manufacture of these dielectric materials. The dielectric materials are useful in the fabrication of multilayer printed circuit boards.
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