Electronic device manufacturing methods
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United States of America Patent
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Jul 21, 1987
Grant Date -
N/A
app pub date -
Oct 28, 1985
filing date -
Oct 29, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic device manufacturing method including a step of forming a layer member to be patterned, which is a conductive metal layer member, a laminate member of a transparent conductive layer and a non-transparent or reflective layer or a non-single-crystal semiconductor layer member, and a step of scanning the layer member by a spot-shaped laser beam or exposing the layer member to radiation by one or more linear pulsed laser beams, thereby forming the patterned layer.
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