Semiconductor device including leadless packages and a base plate for mounting the leadless packages
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United States of America Patent
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Jul 21, 1987
Issued Date -
N/A
app pub date -
Oct 3, 1986
filing date -
Mar 17, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device includes a plurality of leadless packages and a base plate for mounting the leadless packages. The leadless packages include a semiconductor chip housed therein and a plurality of electrodes formed on the surface thereof. The base plate has conductor patterns formed on both of two main surfaces thereof, and the electrodes of each leadless package are soldered to the conductor patterns. The base plate also has a plurality of lead pins which project from one edge thereof in parallel with the main surface.
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