Integrated circuit chip carrier
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 21, 1987
Grant Date -
N/A
app pub date -
May 16, 1985
filing date -
May 18, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A chip carrier includes a body (1) having a central region and sidewalls (31) connected to the central region by an elastically deformable region (33), in order to reduce thermal strains. Also for the same reason a heat sink (41) may be attached underneath the carrier below the carrier's die attachment site (8) and thermally conductive material (40,42) may connect them together. The heat sink may be used for mechanical anchorage. The chip carrier may be produced by injection moulding from an aromatic thermoplastic polymer. A carrier may be moulded with more than one die attachment site or a circuit board with die attachment sites could be moulded, preferably with the die attachment site recessed so that the surface of the die 9 is co-planar with conductive tracks on the board.
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