Method for electroplating non-metallic surfaces
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United States of America Patent
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-
Jul 28, 1987
Issued Date -
N/A
app pub date -
Nov 21, 1985
filing date -
Jun 10, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component which causes the plating to preferentially occur at said sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby a rate differential of the plating-reaction on site-surfaces is achieved with respect to the plating-reaction on a surface consisting of the metal to be plated out.
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