Resin molding compound for sealing electronic parts
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 28, 1987
Grant Date -
N/A
app pub date -
Feb 12, 1986
filing date -
Feb 12, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a resin molding compound for sealing electronic parts. In general, electronic parts are sealed in ceramic packages or synthetic resin molding compounds in order to protect them from an external circumstance in the use thereof. In many cases, materials consisting of synthetic resins and inorganic fillers mainly comprising silicon oxide have been used as sealing materials for synthetic resin molding compounds. However, a defect has occurred in that since an infinitesimal quantity of radioactive elements such as uranium and thorium is contained in inorganic fillers, a memory element in electronic parts produces misactions by alpha-rays radiated from radioactive elements according to circumstances and thereby the fidelity of electronic parts is greatly influenced. The present invention was achieved in order to eliminate this defect and it is an object of the present invention to provide resin molding compounds for sealing electronic parts consisting of synthetic inorganic metal oxides, which are obtained by hydrolyzing, drying, pulverizing and thermally oxidizing purified metal alkoxides having hydrolyzable groups, and synthetic resins.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully