Method for producing a multilayer printed-circuit board
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United States of America Patent
Stats
-
Aug 4, 1987
Grant Date -
N/A
app pub date -
Dec 9, 1985
filing date -
Dec 31, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for producing a multilayer printed-circuit board is disclosed, the method substantially comprises the steps of: printing an electrically conductive paste on one or both sides of a predetermined number of electrically insulated prepreg base plates to form thereon electrically conductive circuits; drying the circuit processed base plates; laminating and pressing the circuit processed base plates into a single laminated board; making holes in the single laminated board, the holes being extended through in the direction of the thickness of the board; and applying an electrical conductor to the inner faces of the holes to make electrically conductive the laminated circuits to each other within the single laminated board.
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