Importance

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Abstract

An automatic soldering apparatus and method thereof is described, wherein a flux is heated up to a predetermined temperature, and is then contacted to a face of a printed base board to thereby coat the base board and to simultaneously heat the latter with the heated flux and then the heated base board is contacted to a melted solder, and wherein provided in combination are apparatus for transporting the base board, apparatus for coating the base board with the heated flux, the flux coating apparatus including a tank in which the flux is stored, heating elements for heating the flux up to a predetermined temperature such that the heated flux is coated on the face of the base board, the heated flux simultaneously heating the base board when the latter is transported to the flux storing tank, and apparatus for soldering the flux coated and heated base board, the soldering apparatus including a tank in which a melted solder is stored which is contacted to the base board when the latter is transported to the tank, and wherein the flux is a solution or a mixture of a solvent which is incombustible and of low evaporability, an activator which may be activated by a temperature higher than that of the heated flux and is stabilized with the temperature of the heated flux and an additive which is easily soluble with the solvent and the activator.

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First Claim