Universal test circuit for integrated circuit packages
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United States of America Patent
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-
Aug 4, 1987
Grant Date -
N/A
app pub date -
Jul 2, 1985
filing date -
Jul 2, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit which facilitates measurement of various integrated circuit packaging parameters, including atmospheric moisture content, impurity content, water vapor transmission rate of encapsulant, corrosion of metallization, temperature, thermal impedance, and strain sensing. This circuit can be interconnected via both wire bonding and mass bonding, and it functions as a test vehicle for the tape automated bonding process. This circuit includes a plurality of subcircuits arranged in a square array such that the test capabilities of both the complete circuit and each individual subcircuit is identical.
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