Composite having improved transverse structural integrity and flexibility for use in high temperature environments

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United States of America Patent

PATENT NO 4687697
SERIAL NO

06774709

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Abstract

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A composite is provided which has improved transverse structural integrity and flexibility and suitable for use in high temperature and high stress environments. The composite has randomly oriented high temperature resistant inorganic fibers interlocked together into a shape sustaining paper with a transverse thickness of from about 0.005 to 0.5 inch. A transverse strength providing high temperature resistant, flexible fabric, made of inorganic fibers is disposed upon at least one of the surfaces of said paper. An organic adhesive is disposed between the paper and the fabric and flexibly bonds the paper to the fabric to form a composite. The composite is sufficiently flexible that it may be folded or pleated without breaking and is capable of being used at high temperatures and at high transverse stresses without rupturing.

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Patent Owner(s)

Patent OwnerAddress
EXIDE ELECTRONICS CORPORATION8521 SIX FORKS ROAD RALEIGH NC 27615

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bond, Leroy E Rochester, NH 1 45
Cambo, William H Rollinsford, NH 4 71
Whitely, Elliott F Acton, ME 1 45

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