Multilayered interposer board for powering high current chip modules
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 18, 1987
Grant Date -
N/A
app pub date -
Mar 10, 1986
filing date -
Mar 10, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayered interposer powering board is disclosed for the distribution of required voltage levels to integrated circuit chip modules under conditions of high current demand and heat induced expansions. The interposer board is introduced between the module and its module mounting board. Flexible connector fingers are intermetallically or ohmically connected between a given level of the interposer board and a given power level of the module.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully