Method for fabricating a printed circuit board assembly and method for the manufacture thereof
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United States of America Patent
Stats
-
Aug 25, 1987
Issued Date -
N/A
app pub date -
Dec 8, 1986
filing date -
Dec 20, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board assembly is disclosed which includes a printed circuit board having in situ molded members for mechanically securing electrical and mechanical components and the like to the printed circuit board. The printed circuit board is manufactured using a method wherein a printed circuit board is initially prepared with the required printed circuit patterns and with apertures for in situ molded members and for the leads of the electrical components. The required molded members are then molded in situ in specified apertures of the printed circuit board. The electrical components are thereafter mechanically secured in place with the in situ molded members and the leads of the components are connected to the contact pads of the printed circuit pattern.
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