Laser machining apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4689467
SERIAL NO

06641979

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This invention relates to improvement in a laser machining apparatus using both a working laser generator (101) and an auxiliary energy supplying apparatus (110) such as a plasma or the like. A feature of the invention is that an auxiliary energy generated from the auxiliary energy supplying apparatus is radiated on a workpiece (118) to a location which is slightly apart from an irradiation point of a working laser beam. In a preferred embodiment, the auxiliary energy supplying apparatus (110) is attached to a rotary disk (113) thereby allowing the auxiliary energy to be radiated to a location which is always preceding an irradiation point of the laser beam in the working progressing direction. The auxiliary energy may be radiated onto a surface opposite to the surface of a workpiece to which the laser beam is radiated. With such an arrangement, working efficiency and accuracy are improved and a structure of the whole system is also simplified, resulting in less failure. To further improve the working efficiency, in a desirable embodiment, an abrasive grain may be supplied to the working portion, or a high-pressure working fluid may be jetted thereto, or a working fluid to which an ultrasonic vibrational energy was applied may be supplied thereto. Further, a focal point automatic adjusting mechanism of the laser beam may be provided.

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Patent Owner(s)

Patent OwnerAddress
INOUE-JAPAX RESEARCH INCORPORATED5289 AZA MICHIMASA NAGATSUDAMACHI MIDORIKU A CORP OF JAPAN YOKOHAMASHI KANAGAWAKEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Kiyoshi Tokyo, JP 360 5716

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