Method of printing a pattern on a surface receptive to sublimation printing
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United States of America Patent
Stats
-
Sep 8, 1987
Grant Date -
N/A
app pub date -
Jan 16, 1985
filing date -
May 17, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of printing a pattern on a surface receptive to sublimation dye, in which (a) the back of a carrier foil (1) provided with sublimation dye is caused to adhesively contact an auxiliary carrier (4) by means of an adhesive (5) of greater adhesiveness to the auxiliary carrier (4) than to the carrier foil (1), (b) the pattern to be transferred is cut or punched in mirror-reversed form in the carrier foil (1) without cutting through the auxiliary carrier (4), (c) excess carrier foil (11) is released from the auxiliary carrier (4), and (d) the auxiliary carrier (4) with the applied positive or negative cut or punched pattern (10) is caused to adhesively contact the surface, is pressed and heated. The sublimation foil (9) consists of a carrier foil (1) of paper or plastics whose front is provided with a layer of sublimation dye and whose back is provided with an auxiliary carrier (4) by means of an adhesive (5) of greater adhesiveness to the auxiliary carrier ( 4). The method enables simplified mounting of composite patterns as it directly provides the desired positioning and spacing of the characters.
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