Method and apparatus for drawing a thick film circuit
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United States of America Patent
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-
Sep 8, 1987
Grant Date -
N/A
app pub date -
Dec 16, 1985
filing date -
Apr 16, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for drawing a thick film circuit on a substrate (2) by discharging a paste from a paste discharge hole provided at one end of a drawing nozzle (1), the drawing nozzle (1) being located close to the substrate (2) and relatively moved with respect to the substrate (2). The discharge rate of the paste is controlled in accordance with the relatively moving speed between the drawing nozzle (1) and the substrate (2), thereby preventing variations of film thickness and line width caused by variations in the moving speed and making it possible to form a thick film circuit at a high speed and with high accuracy.
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