Method of forming conductor path
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United States of America Patent
Stats
-
Sep 15, 1987
Grant Date -
N/A
app pub date -
Nov 30, 1984
filing date -
Feb 10, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A conductor path is formed by providing an insulating substrate having a surface region which is formed of an insulating composition. The insulating composition contains an organic polymeric material and at least one metal source. The metal source is a metallic powder and/or an organic compound chemically combining a metal or metals. The surface region of the substrate is selectively heated along a predetermined pattern, thereby decomposing and evaporating the organic polymeric material at the heated portion and welding the metal in the heated portion so as to form a conductor path formed of the metal.
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