Socket for stacking integrated circuit packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 29, 1987
Grant Date -
N/A
app pub date -
Dec 13, 1985
filing date -
Dec 13, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A socket for stacking and interconnecting corresponding leads of two integrated circuit packages having the contacts stamped and formed in a lead frame configuration with a dielectric body molded over a portion of the terminal ends. Two contact halves are sheared from the opposite end of the terminal, one contact formed upwardly while the second contact is formed downwardly. Integrated circuit package leads can be selectively commoned by jumpering the terminal ends prior to molding the body.
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