IC card
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United States of America Patent
Stats
-
Sep 29, 1987
Grant Date -
N/A
app pub date -
Feb 24, 1986
filing date -
Mar 4, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In an IC card, contact pads 7A and wiring patterns 7B are formed on a sheet-like structure and contact segments 7-1 to 7-8 are formed on the contact pads 7A. Main chip 5 and sub-chip 6 are mounted on the sheet-like structure. A sheet film is laminated on the sheet-like structure and the contact segments are fitted in openings of the sheet film. The sheet film has a thickness substantially equal to that of the contact segments.
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