Ultra high density pad array chip carrier
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United States of America Patent
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Oct 13, 1987
Grant Date -
N/A
app pub date -
Jan 3, 1986
filing date -
Jan 3, 1986
priority date (Note) -
Expired
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Abstract
An ultra high density pad array chip carrier is disclosed which includes a ceramic substrate having a plurality of electrical conductors each of which connect to a respective through-hole plugged with solder on its bottom surface. These solder plugs form a pad array for the chip carrier as well as provide a hermetic seal for the ceramic substrate. A polymer dielectric layer is affixed to the top surface of the ceramic substrate which provides an insulated metal die mount pad thereon. The electrical conductors on the ceramic substrate are formed using well-known vacuum metallization techniques to achieve much narrower widths. Approximately a 40 percent reduction in overall size and cost is achieved utilizing this improved arrangement, which improves reliability and facilitates post-assembly cleaning of the chip carrier when mounted to its final board.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- MOTOROLA, INC.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Dorinski, Dale | Coral Springs, FL | 2 | 206 |
Freyman, Bruce J | N. Lauderdale, FL | 17 | 1906 |
Shurboff, John | Coral Springs, FL | 3 | 227 |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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