Mounting structure of flat-lead package-type electronic component

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United States of America Patent

PATENT NO 4703393
SERIAL NO

06757308

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Abstract

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A mounting structure of a flat-lead package-type electronic component wherein ends of lead terminals drawn out from a surface of a package are bent to be horizontal with respect to the plane of the package and other portions of said lead terminal are tilted inward by a desired angle with respect to the normal of the plane.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU LIMITED1-1 KAMIKODANAKA 4-CHOME NAKAHARA-KU KAWASAKI-SHI KANAGAWA 211-8588

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawamura, Yasuo Hachioji, JP 28 334
Okada, Nobuhide Kawasaki, JP 4 42
Yamamoto, Tsuyoshi Yokohama, JP 324 4081

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