Chip carrier mounting device
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United States of America Patent
Stats
-
Nov 10, 1987
Issued Date -
N/A
app pub date -
May 14, 1984
filing date -
Jun 30, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A chip carrier mounting device which is hereinafter also referred to as an 'interconnection preform placement device' includes a retaining member having a predetermined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatique. A method of forming resilient interconnections comprises placing the interconnection retaining member device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.
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Cited Art Landscape
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