High density, controlled impedance connectors
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United States of America Patent
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-
Nov 10, 1987
Issued Date -
N/A
app pub date -
Feb 25, 1987
filing date -
Aug 5, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high density electrical connector is shown in which discrete dielectric wafers mount several contact elements within grooves on a first surface of the wafer while mounting a single ground plane within a recess on a second surface. This configuration, when the wafers are stacked side-by-side, forms the contacts in a stripline connection in which the impedance of each contact may be controlled. The wafers may be inserted into slots within a housing to form a high density connector for joining a daughter board to a mother board.
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