Copper-type conductive coating composition
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United States of America Patent
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Nov 10, 1987
Issued Date -
N/A
app pub date -
Jun 26, 1986
filing date -
Jul 31, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A copper-type conductive coating composition which comprises: (A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with its oxidized surface layer removed by treatment with an organic carboxylic acid, (B) a coating binder resin, and (C) an antioxidant selected from triazoles represented by the formula: ##STR1## wherein Y is a hydroxyl group, a hydrogen atom, a C.sub.1 -C.sub.18 alkyl group or a halogen atom, and a is an integer of 1 to 3, and trithiophosphites represented by the formula: ##STR2## wherein each of R.sub.1 to R.sub.3 is a C.sub.1 -C.sub.30 alkyl group or an allyl group.
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