Dielectric for laser trimming
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 24, 1987
Grant Date -
N/A
app pub date -
Oct 16, 1986
filing date -
Oct 16, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The thickness of the dielectric material of an integrated circuit on top of which is provided a semiconductor layer, is selected to be an integer multiple of one-half the wavelength of the laser light in the dielectric material in order to make the dielectric material layer invisible to the laser-trimming light.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully