Method for producing an integrated circuit product having a polyimide film interconnection structure
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United States of America Patent
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-
Dec 1, 1987
Grant Date -
N/A
app pub date -
Jan 31, 1986
filing date -
Jan 31, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for making integrated circuits in which a polyimide/conductor multilevel film is cast on a substrate, using available or existing semiconductor processing equipment. The polyimide film is formed from readily available polyamic acid resins, and the conductor can be sputtered aluminum formed to interconnection conductor patterns by standard photolithographic techniques. After fabrication of the multilayer film, the conductors of the film and the device circuit are brought into aligned contact, and the device circuit affixed to the film. The film and the device are then removed from the substrate for further processing, such as bonding the device and film to a mother board or leadframe, as desired.
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