Pressure welding bonding apparatus
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United States of America Patent
Stats
-
Dec 1, 1987
Grant Date -
N/A
app pub date -
Mar 13, 1986
filing date -
Mar 6, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The bonding apparatus has a holding device, a pressing device for pressure welding substances to be bonded to each other, and a superhigh vacuum bonding chamber provided with the holding device and the pressing device. A superhigh vacuum bonding preparatory chamber is connected with the superhigh vacuum bonding chamber through a gate valve and a conveyor is arranged for conveying the substances to be bonded between the superhigh vacuum bonding preparatory chamber and the superhigh vacuum bonding chamber. The preparatory chamber is provided with a rotary preparatory table having a plurality of stages for releasably supporting holders for holding the substances to be bonded, the preparatory table being moved to successive positions to register with the conveyor.
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Cited Art Landscape
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