An apparatus is disclosed for placing wafer pieces into molding depressions of casting molds. The casting molds are continuously conveyed by a conveyor in a direction of travel. The wafer pieces are delivered with upwardly facing top faces to a support plate or a separating device which is spaced above the plane of conveyance for the casting molds and are moved on said support plate or through said separating device in a direction which is opposite to the direction of travel of the molds. A transfer device is provided between the conveyor, on the one hand, and the support plate or the separating device, on the other hand, and is provided with retaining elements for retaining the wafer pieces operable to gradually reverse the wafer pieces until they move upside down in the direction of travel of the casting molds in synchronism therewith and in register with respective ones of said molding recesses. By means of the separating device or the transfer device, the wafer pieces are laterally separated and by means of the transfer device are longitudinally separated until they have the same lateral and longitudinal spacing as said molding depressions.
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