Method for handling semiconductor die and the like
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United States of America Patent
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-
Dec 8, 1987
Issued Date -
N/A
app pub date -
Jan 29, 1987
filing date -
Aug 29, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Method for handling semiconductor chips and the like objects are disclosed which include the use of a flat flexible film that is supported on a flat porous texturized fabric sheet such as a woven or knit fabric having spaced fiber crossovers. Objects, are supported on the flat flexible film in intimate surface contact therewith for securely holding the same in position by interfacial forces therebetween. Adhesive may be included for increasing the interfacial force. To facilitate removal of objects from the film, the fabric is connected to a vacuum source for drawing portions of the flexible film over and between crossovers in the fabric whereby portions of the flexible sheet are withdrawn from the objects. The contact area and interfacial forces between the flexible sheet and objects is thereby reduced to enable removal of the objects from the sheet using conventional object handling techniques.
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