Importance

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Abstract

In the present publication a method is described for encapsulating of components (3), in particular of semiconductor components, mounted on a carrier tape (6) by means of a polymer in order to prevent access of moisture into the component (3). According to the invention a polymer film (24, 25) is pressed onto the support area (2) of each component (3) from both sides of the carrier tape (6), and the carrier tape (6) treated in this way is subjected to warm-air blasting (14). Thereupon, an encapsulating tape (9) that has been moistened with polymer (13) and subjected to a warm-air treatment (15) is connected to one side of the carrier tape (6), and the combination tape (6, 9) in this way obtained is heated in a pre-heating oven (16). Hereupon, encapsulating polymer (26) is spread by means of a dispensing and spreading device (17, 18), onto the face of the component (3) and then onto its ILB area (19), and the combination tape (6, 9) in this way treated is heated in an oven zone (20) in order to harden the polymer. Finally, the encapsulating tape (9) is detached from the carrier tape (6) now containing the encapsulated components (3).

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First Claim