Nickel particle plating system
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United States of America Patent
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-
Dec 8, 1987
Grant Date -
N/A
app pub date -
Jun 19, 1986
filing date -
Jun 19, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A nickel particle plating system in which a multiplicity of minute nickel particles are provided with gold and silver coatings and are deposited in a nonconductive matrix to form an electro-conductive body in which the particles may be placed along conductive paths. The coatings are applied to the particles in a unique manner which enables the realization of a gold coating having a maximum thickness of about 5 percent of the maximum particle dimension and a silver coating having a maximum thickness of about 10 percent of the maximum particle dimension.
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