Barrier layer and orifice plate for thermal ink jet print head assembly and method of manufacture
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United States of America Patent
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-
Dec 29, 1987
Issued Date -
N/A
app pub date -
Oct 3, 1986
filing date -
Nov 22, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This application discloses a thermal ink jet printhead and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly. This assembly includes constricted ink flow ports to reduce cavitation damage and smooth contoured convergent ink ejection orifices to prevent 'gulping' of air during an ink ejection process. Both of these features extend the maximum operating frequency, fmax, of the printhead. The nickel barrier layer and the underlying thin film resistor substrate are gold plated and then soldered together to form a good strong solder bond at the substrate - barrier layer interface.
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