Method of bonding conductors to semiconductor devices
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United States of America Patent
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-
Jan 5, 1988
Grant Date -
N/A
app pub date -
Feb 24, 1986
filing date -
Feb 24, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a method of forming strong bonds between gold spheres and contact pads on semiconductor devices and the resulting product. The spheres are formed by establishing ball bonds with wire bonding techniques and then severing the wire. The wire material is a gold alloy including palladium which forms a weakened portion above the ball bond so that the wire can be easily broken off.
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