Soldering compositions, fluxes and methods of use

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United States of America Patent

PATENT NO 4717430
SERIAL NO

06924308

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of joining metal surfaces is provided which comprises contacting the metal surfaces with a zinc-based composition and joining the metal surfaces, the zinc-based composition comprising, by weight: from about 0.1 to about 4 percent copper; from about 0.1 to about 1 percent nickel; from about 0.01 to less than 0.5 percent aluminum; 0 to about 0.5 percent chromium; 0 to about 0.5 percent titanium; and the remainder being zinc is also provided. The composition is useful for coating metal surfaces, particularly metals formed of or containing copper. The above composition and method may be used with or without a flux. Particularly beneficial results are obtained when a flux having a composition comprising, by weight: from about 5 to about 70 percent ZnCl.sub.2 ; from about 1 to about 28 percent NH.sub.4 Cl; from about 0.1 to about 10 percent SnCl.sub.2 ; from about 0 to about 10 percent HCl; from about 0 to about 10 percent Li.sub.2 B.sub.4 O.sub.7 ; from about 0 to about 5 percent MgBr.sub.2 ; from about 0 to about 5 percent ZnBr.sub.2 ; and about 0 to about 94 percent water is used.

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Patent Owner(s)

  • COPPER DEVELOPMENT ASSOCIATION, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beal, Roy E Scottsdale, AZ 4 54

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